GOEPPEL Multi Line – One Platform for Multiple Applications in Electronics Manufacturing

Highest quality for inspecting THT components

Multi Line fully displays its flexibility when inspecting THT assemblies. Different camera modules can be used for 3D measurements or for the inspection of very tall components. The system supports transport with or without carriers and also applies to the return transport of assemblies in the lower part of the system.

Multi Line also enables 3D solder joint inspection of THT assemblies during return transport. This means a wide range of configuration and integration variants are available, allowing Multi Line to be perfectly customized to the specific process and production line layout.

One platform for multiple applications

Multi Line is a common platform for a wide range of inspection tasks within electronics manufacturing. Depending on the configuration, the system can be used for solder paste inspection (SPI), classic AOI applications for SMD or THT processes, and conformal coating inspection (CCI).

Integration Options for THT Production

• Manual or automated feeding via accumulating transport system
• Component side and solder side inspection at multiple positions
• Solder side inspection on the upper conveyor or during PCB return in the lower system area

Speed Advantages

• “Flip-free” double-sided inspection of THT assemblies
• Multiple independently working AOI modules in one system

Downloads

→ Multi Line AOI THT Brochure (PDF)

→ Technology Range (PDF)

→ AOI PILOT Software (PDF)

→ GOEPPEL Full Catalog (PDF)