LMPA - Low Melting Point Alloys

Interflux LMPA™ Low Melting Point Solder Alloys

Revolutionarily Lower Temperatures • Faster Production • Fewer Defects • Lower Costs

What are LMPA™?

LMPA™

LMPA^™ stands for Low Melting Point Alloys^™. These alloys allow you to use soldering temperatures that are considerably lower than for the traditional lead-free Sn(Ag)Cu (SAC) alloys.

LMPA-Q™

LMPA-Q^™ is an enhanced LMPA^™ with superior mechanical properties. It's without exception the best alloy we have developed so far. The benefits are numerous.

What LMPA-Q™ will allow you to do

Solder at lower temperatures between 190ºC and 250ºC
Solder 5 times faster with zero defects
Reduce voiding below 10%
Reduce production costs
Increase production line capacity
Reduce your carbon footprint
Avoid heat-related board and component failures
No more need for nitrogen
Eliminate dross formation (oxides)
Excellent wetting

For all soldering processes

LMPA^™-Q can be used for all soldering processes:

Wave soldering Selective soldering Reflow soldering

LMPA-Q: 200°C - 230°C LMPA-Q: 200°C - 250°C LMPA-Q: 190°C - 220°C

Sn(Ag)Cu: 260°C - 280°C Sn(Ag)Cu: 270°C - 320°C Sn(Ag)Cu: 235°C - 250°C

5 times faster soldering with zero defects

LMPA^™-Q allows for up to 5 times faster production speeds than Sn(Ag)Cu alloys in combination with lower preheat and soldering temperatures. LMPA-Q provides easy through-hole wetting on thermally heavy components and all finishes including OSP. Moreover, the low oxidation and bridging behaviour of LMPA-Q will facilitate a zero defect process.

Drastically reduce solder voiding

With the LMPA^™-Q alloy voiding levels can be reduced to between 1% and 10% (Sn(Ag)Cu typically 10% to 35%).

Reduce production costs

20%-25% lower electricity bills
95% less wasted alloys
Soldering without nitrogen
Lower alloy cost (no silver)
Higher first pass yields
Eliminate heat-related failures

Avoid heat related board and component failures

The lower soldering temperatures of the LMPA^™-Q alloy will virtually eliminate heat-related board and component failures and allow the use of lower cost materials.

Eliminate dross formation

The LMPA^™-Q does not need nitrogen for wave soldering. Due to its low oxidation behaviour, dross formation is reduced to an absolute minimum.

Excellent wetting

The LMPA^™-Q alloy gives excellent wetting on all finishes, including OSP.

Developed with 38 years of experience in soldering chemistry

Interflux® Electronics NV has been researching and developing soldering chemistry since 1980. That's 38 years of know-how bundled into the LMPA™. That's your guarantee of unrivaled market-leading quality in soldering fluxes, solder wires, solder pastes and spray fluxers for the electronics assembly industry.