No-clean, halide free, solder paste for low melting point lead-free alloys
Description
DP 5600 is a no-clean halide free solder paste for low melting point SnBi(Ag) alloys.
The solder paste is typically being used for soldering components with sensitivity to high temperatures, like e.g. LEDs, Elcos, components with plastic bodies, etc... Another field of use is the soldering of shieldings.
DP 5600 provides good wetting and clean soldering results without the typical black spots.
The paste combines low voiding with a high stability on the stencil.
DP 5600 is absolutely halogen free, providing optimal reliability after soldering. The residues after reflow are minimal and clear.
DP 5600 is classified as RO L0 according IPC and EN standards.
Key advantages:
Technical Data Sheet TD PL 5720 Pb-free
Technical Data Sheet LP 5720 SnPb(Ag)
Absolutely halide free lead-free solder paste
Description
LP 5720 is a no-clean, absolutely halide free and lead-free solder paste developed for increased stability on the stencil and clear residues after reflow.
The solder paste keeps its rheological properties under a wide variety of atmospheric conditions, assuring a stable and reproductive printing process.
LP 5720 is suitable for both low and high as well as short and long lead-free reflow profiles.
The residues of the solder paste are minimal and clear, also after long and high reflow profiles. Residues are pin testable. LP 5720 exhibits acceptable voiding for lead-free alloys.
LP 5720 is absolutely halide free providing optimal reliability after soldering. The solder paste is classified as RO L0 according IPC and EN standards.
Key properties
