No-clean • Halide-free • Low Residue • Designed for Lead-Free Soldering
IF 2005 Series Application Document
Description: Interflux® IF 2005M is a low solids no-clean flux, designed to evaporate during the soldering process. This makes it the safest no-clean flux for high-tech circuits.
With no rosin or resin to create a sticky residue, there is nothing left after wave soldering to foul test pins or prevent electrical contact. Machine and carrier pollution is very low compared to other fluxes.
This halide-free flux meets all Bellcore and IPC requirements and is QPL-listed (approved to MIL-F14256F). It provides excellent solderability on HAL, NiAu, I-Sn, I-Ag and OSP coated PCBs.
IF 2005M works great with lead-free alloys. It is resistant to elevated preheating temperatures and long wave contact times.
The flux has very high compatibility with conformal coatings. Classified as OR/L0 per IPC J-STD-004.
| Appearance | Clear colourless liquid |
|---|---|
| Solid Content | 1.85% ± 0.15 |
| Density at 20°C | 0.807 – 0.809 g/ml |
| Water Content | 3-4% |
| Acid Number | 14 – 16 mg KOH/g |
| Flash Point | 15°C (59°F) |
IF 2005 Series Application Document
Description: Interflux® IF 2005K is a low solids no-clean flux, especially designed for lead-free wave soldering.
It can also be used for SnPb wave or selective soldering, but IF 2005M and IF 2005C are preferred in those cases.
IF 2005 Series Application Document
Description: Interflux® IF 2005C is a low solids no-clean flux, especially developed for selective soldering in lead-free and SnPb applications. It has the largest process window in activity within the IF 2005 series.
Technical Data Sheet SelectIF 2040
Description: SelectIF 2040 is a VOC-free, no-clean flux developed for selective soldering. It combines a wide process window with low residue formation.
Technical Data Sheet Pacific 2009M
Interflux T2005M is the thinner/conditioner for the IF2005 series fluxes when used in foam fluxing or other open flux applications.
Manufacturer: Interflux • Source: Interflux Official Materials • Generated May 2026
