InterFlux Soldering Fluxes

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Interflux Soldering Fluxes – Full Range

No-clean • Halide-free • Low Residue • Designed for Lead-Free Soldering

IF 2005M No-clean, Halide-free, No Residue™ Soldering Flux

Technical Data Sheet IF 2005M

IF 2005 Series Application Document

Description: Interflux® IF 2005M is a low solids no-clean flux, designed to evaporate during the soldering process. This makes it the safest no-clean flux for high-tech circuits.

With no rosin or resin to create a sticky residue, there is nothing left after wave soldering to foul test pins or prevent electrical contact. Machine and carrier pollution is very low compared to other fluxes.

This halide-free flux meets all Bellcore and IPC requirements and is QPL-listed (approved to MIL-F14256F). It provides excellent solderability on HAL, NiAu, I-Sn, I-Ag and OSP coated PCBs.

IF 2005M works great with lead-free alloys. It is resistant to elevated preheating temperatures and long wave contact times.

The flux has very high compatibility with conformal coatings. Classified as OR/L0 per IPC J-STD-004.

Physical Properties

Appearance Clear colourless liquid
Solid Content 1.85% ± 0.15
Density at 20°C 0.807 – 0.809 g/ml
Water Content 3-4%
Acid Number 14 – 16 mg KOH/g
Flash Point 15°C (59°F)

Key Advantages

  • QPL listed
  • Absolutely halide-free
  • For lead-free and SnPb soldering
  • No Residue™ technology
  • Very high compatibility with conformal coatings
  • High stability in foam fluxing

IF 2005K No-clean, Halide-free Soldering Flux

Technical Data Sheet IF 2005K

IF 2005 Series Application Document

Description: Interflux® IF 2005K is a low solids no-clean flux, especially designed for lead-free wave soldering.

It can also be used for SnPb wave or selective soldering, but IF 2005M and IF 2005C are preferred in those cases.

IF 2005C No-clean, Halide-free Soldering Flux

Technical Data Sheet IF 2005C

IF 2005 Series Application Document

Description: Interflux® IF 2005C is a low solids no-clean flux, especially developed for selective soldering in lead-free and SnPb applications. It has the largest process window in activity within the IF 2005 series.

SelectIF 2040 VOC-free, No-clean Soldering Flux for Selective Soldering

Technical Data Sheet SelectIF 2040

Description: SelectIF 2040 is a VOC-free, no-clean flux developed for selective soldering. It combines a wide process window with low residue formation.

Pacific 2009M VOC-free, No-clean Soldering Flux for Spray Applications

Technical Data Sheet Pacific 2009M

Cleaning Pacific 2009M by KYZEN

Preheating for Water-based Fluxes

Pacific 2009MLF VOC-free, No-clean Soldering Flux for Spray Applications

Technical Data Sheet Pacific 2009MLF

Preheating for Water-based Fluxes

Pacific 2009MLF-E VOC-free, No-clean Soldering Flux for Spray Applications

Technical Data Sheet Pacific 2009MLF-E

Preheating for Water-based Fluxes

Pacific 2010F VOC-free, No-clean Soldering Flux for Foam and Spray Applications

Technical Data Sheet Pacific 2010F

Preheating for Water-based Fluxes

T 2005M Flux Thinner

Interflux T2005M is the thinner/conditioner for the IF2005 series fluxes when used in foam fluxing or other open flux applications.

Manufacturer: Interflux • Source: Interflux Official Materials • Generated May 2026


AJÁNLOTT TERMÉK INTEON 3 years warranty