InterFlux Soldering Pastes

Interflux Solder Pastes – LMPA-Q6 (DP 5600) & LP 5720

No-clean • Halide-free • High Stability • Excellent for Lead-Free Soldering

LMPA-Q6 (DP 5600) No-clean, Halide-free Solder Paste for Low Melting Point Lead-Free Alloys

Description: DP 5600 (LMPA-Q6) is a no-clean halide free solder paste for low melting point SnBi(Ag) alloys.

The solder paste is typically used for soldering temperature-sensitive components such as LEDs, electrolytic capacitors, plastic-bodied components, etc. Another field of use is the soldering of shieldings.

DP 5600 provides good wetting and clean soldering results without the typical black spots.

The paste combines low voiding with high stability on the stencil.

DP 5600 is absolutely halogen free, providing optimal reliability after soldering. The residues after reflow are minimal and clear.

DP 5600 is classified as RO L0 according to IPC and EN standards.

Key Advantages

High stability on the stencil
Good wetting on many surface finishes
Clean soldering result, no black spots
Low voiding
Low residue after reflow
Absolutely halogen free

LP 5720 Absolutely Halide-free Lead-Free Solder Paste

Technical Data Sheet LP 5720 Pb-free

Technical Data Sheet LP 5720 SnPb(Ag)

Description: LP 5720 is a no-clean, absolutely halide free and lead-free solder paste developed for increased stability on the stencil and clear residues after reflow.

The solder paste keeps its rheological properties under a wide variety of atmospheric conditions, assuring a stable and reproducible printing process.

LP 5720 is suitable for both low and high as well as short and long lead-free reflow profiles.

The residues of the solder paste are minimal and clear. LP 5720 exhibits acceptable voiding for lead-free alloys.

LP 5720 is absolutely halide free providing optimal reliability after soldering. Classified as RO L0 according to IPC and EN standards.