Göpel X-Line 3D automated X-ray inspection

GOEPEL X-Line · 3D – High-End Inline 3D AXI X-Ray Inspection System

Double-Sided 3D X-Ray • Planar CT Technology • Fast Inline Inspection • Hidden Joint Analysis

Overview

The X-Line · 3D is GOEPEL’s flagship inline 3D Automated X-ray Inspection (AXI) system. It enables high-speed, double-sided 3D X-ray inspection of complex electronic assemblies in mass production. Thanks to its innovative planar CT technology and multi-angle image acquisition, it delivers outstanding visibility of hidden solder joints (BGA, QFN, LGA, THT, press-fit pins, etc.) that cannot be inspected by optical AOI systems.

Key Features

True inline 3D X-ray inspection of both sides of the PCB
High-speed parallel image acquisition with MultiAngle detectors
Advanced Planar CT (Computed Tomography) for detailed 3D analysis
Excellent detection of voids, head-in-pillow, bridging, insufficient solder, etc.
Maintenance-free 130 kV X-ray source
Three-chamber system for continuous flow (load – inspect – unload)
Flexible integration into MES / Industry 4.0 environments
Comprehensive traceability and statistical process control (SPC)

Technical Specifications
	
			Parameter
			Specification
		
			PCB Size
			max. 450 × 400 mm (larger on request)
		
			Resolution
			6 – 20 µm (freely selectable)
		
			X-Ray Source
			130 kV, maintenance-free
		
			Inspection Methods
			2D, 2.5D, 3D Planar CT
		
			Detector Technology
			MultiAngle line detectors
		
			Cycle Time
			Extremely fast inline cycle (depending on PCB)
		
			Dimensions (W×D×H)
			approx. 1596 × 1540 × 1720 mm
		
			Weight
			approx. 2,600 kg

Parameter	Specification
PCB Size	max. 450 × 400 mm (larger on request)
Resolution	6 – 20 µm (freely selectable)
X-Ray Source	130 kV, maintenance-free
Inspection Methods	2D, 2.5D, 3D Planar CT
Detector Technology	MultiAngle line detectors
Cycle Time	Extremely fast inline cycle (depending on PCB)
Dimensions (W×D×H)	approx. 1596 × 1540 × 1720 mm
Weight	approx. 2,600 kg