PRODUCT FEATURES
High precision High speed High performance
High precision control platform
The motion platform adopts the double driver system, high-speed, stable, no vibration, no noise
High speed industry camera
Multi projective structure grating system
The N step phase shifting algorithm based on the white light moire fringe technique,
providing high inspect accuracy; There are multiple grating for option to deal with light and
shadow
Integrated excellent detection algorithm, can inspect the chip floating and the IC lifted
The unique 3D point cloud reconstruction technology can greatly improve the detection accuracy and detection ability, can effectively cover the 2D detection blind area, 2D is difficult to detect the IC foot, the buoyancy of parts can reach 100% detection rate.
Comprehensive and sophisticated visual recognition system
Under the deep coordination of 12MP high-definition COAXPRESS ultrahigh speed camera and several sets of 1080P digital projection units,
through multi-stage RGBW four-color LED tower light source, 360° nondead
angle digital projection and efficient image acquisition and real effect
can be achieved.
True color 3D image
Phase measuring profilometry (PMP) based on the
sinusoidal motion projection by structure grating, the
multiple images by discrete phase shift, to calculate
the phase distribution by multi-phase, the
triangulation and so on to get the high-precision
outline and volume of the object, to achieve the
display of true-color 3D stereoscopic images.
Specifications
CATEGORY |
ITEM |
SPECIFICATION |
Inspection System |
Camera |
Digital high-speed CCD 12MP camera |
Resolution |
10μm for standard setting, 15μm for option |
|
Lens |
Telecentric Lens |
|
Light |
Ring RGBW LED light |
|
Projection System |
4 directional projection gratings |
|
FOV |
60*45mm(15μm) □ 40*30mm(10μm) □ |
|
Per-image Time |
<0.5s |
|
NG Type |
Missing, shift, skewed, tombstone, billboard, overturned, reversed polarity, wrong, damaged, overflow, insufficient,short, dimension,lifted chip, lifted lead |
|
Minimum component |
01005& 0.3mm pitch(15um) |
|
3D height measurement range |
-2~20mm |
|
Height resolution |
0.4um |
|
Height Accuracy on a Certificated Target |
±3μm |
|
GR&R |
<1%@3sigma |
|
PCB Warpage |
±5μm(2%) |
|
Mechanical System |
PCB Conveyor |
Left to right or right to left (One key shift) |
PCB fixing: bottom-up, PCB warp correction. |
||
Automatic PCB loading and unloading, Adjustable clearance, Conforming SMEMA standard. |
||
Conveyor clearance: 900±20mm |
||
PCB Size |
50×50mm-510×460mm (510x510mm option) |
|
PCB Thickness |
0.5mm – 5.0mm |
|
Component Clearance |
TOP≤50mm, BOT≤50mm(customized for special requirements) |
|
Driver |
AC servo,camera moves in the directions of X/Y. |
|
Orientation |
<10um |
|
Moving Speed |
Standard:500mm/s,Max:800mm/s |
|
Soft System |
Operation System |
Microsoft Windows Win10X64 |
Operation |
Graphic programming, Chinese, English |
|
Programming |
CAD、handwork programming, Support offline programming(Optional) |
|
Computer |
CPU INTEL I9, RAM 128GB,HDD:1TB SSD+2TB HDD; GPU:RTX 1650 |
|
Display |
24 inch LED |
|
Network |
Multi machine control |
The operator can control multi same machines in the control terminal |
Network |
NG adaptable, check and correct PCBA defects at repair station |
|
Communication port |
SMEMA, RS232,RJ45 |
|
Other |
Air Supply |
0.5MPA.80cm³/min |
Machine Dimensions |
1200×1280×1660mm |
|
Weight |
~850kg |
|
Power Supply |
AC220V, 10%, single phase 5A 50/60HZ, power consumption 1000W with UPS inside |
|
Working Environment |
Temperature10-40℃, humidity 30-80% RH |