INTEON Galaxy Plus Stencil Printer

Fully Automatic SMT Solder Paste Printer Galaxy Plus
Best Price and Value Ratio

INTEON Fully Automatic Visual Solder Paste Scereen Printer/ SMT Stencil Printer


Simple and reliable structure, accurate positioning and easy to adjust, It can quickly achieve different thickness of the PCB board PIN pin height adjustment of the automatic adjustment. The spray nozzle makes the cleaning liquid evenly sprinkled on the wiping paper, and the arc-shaped rubber wipe board is soft, antiwear and antirust, clean thoroughly bidirectionally.

1. Accurate optical positioning system
Four way light source is adjustable, light intensity is adjustable, light is uniform, and image acquisition is more perfect; Good identification (including uneven mark points), suitable for tinning, copper plating,Gold plating, tin spraying, FPC and other types of PCB with different colors.

2. High efficiency and high adaptability stencil cleaning system
The new wiping system ensures full contact with the stencil ; three cleaning methods of dry, wet and vacuum, and free combination can be selected; soft wear-resistant rubber wiping plate, thorough cleaning, convenient disassembly, and universal length of wiping paper.

3. Intelligent squeegee system
Intelligent programmable setting, two independent direct motors driven squeegee, built-in precise zero pressure detection system.

4. Simple and reliable PCB positioning system
The platform height is automatically calibrated according to PCB thickness setting, which is intelligent, fast, simple and reliable in structure.

5. Printing axis servo drive
The Squeegee Y axis servo with screw drive,higher accuracy,more stable operation, extend the service life,to provide a good printing control platform for customers

6. 2D solder paste printing quality inspection and SPC analysis
2D function for offset,less tin, leakage,tin connection and other printing problems can be quickly detected, the detection point arbitrary increase;The SPC software can analyze the samples collected by the machine CPK index ensures printing quality.
 

Technical Parameters:

PCB parameters

 

Maximum board size(X x Y)

450mm x 350mm

Minimum board size(X x Y)

50mm x 50mm

PCB thickness

0.4mm~6mm

Warpage

≤1%Diagonal

Maximum board weight

3Kg

Board margin gap

Configuration to 3mm

Maximum bottom gap

20mm

Transfer speed

1500mm/s(Max)

Transfer height from the ground

900±40mm

Transfer orbit direction

Left-Right,Right-Left,Left-Left,Right-Right

Transfer mode

One stage orbit

PCB damping method

Programmable flexible side pressure + Adaptive PCB board thickness + Edge lock base clamp
(Optional: 1. Multipoint partial vacuum of the bottom; 2. Edge locking and substrate clamping)

Support method

Magnetic thimble,  Equal high block,etc.(Optional:1.Vacuum Chamber;2.Special workpiece fixture)

Printing parameters

 

Printing head

Floating intelligent printing head   (two independent direct connected motors)

Template frame size

470mm x 370mm~737 mm x   737 mm

Maximum printing area(X x Y)

450mm x 350mm

Squeegee type

Steel scraper/Glue scraper(Angel   45°/50°/60° matching the printing process)

Squeegee length

300mm(optional with length of 200mm-500mm)

Squeegee height

65±1mm

Squeegee thickness

0.25mm Diamond-like carbon coating

Printing mode

Single or double scraper printing

Demoulding length

0.02 mm - 12 mm

Printing speed

0 ~ 200 mm/s

Printing pressure

0.5kg - 10Kg

Printing stroke

±200 mm (From the center)

Cleaning   parameters

 

Cleaning mode

1. Drip cleaning system;   2. Dry, wet and vacuum modes

Length of cleaning and   wiping board

380mm(optional with 300mm, 450mm, 500mm)

Image   parameters

 

Field of view

8mm x 6mm

Platform adjustment range

X:±5.0mm,Y:±7.0mm,θ:±2.0°

Benchmark point type

Standard shape benchmark   point(SMEMA standard),solder pad/openings

Camera system

Independent   camera,upwards/downwards imaging vision system

Performance parameters

 

Repetition precision of image calibration

±10.0μm @6 σ,Cpk ≥ 2.0

Repetition precision of printing

±20.0μm @6 σ,Cpk ≥ 2.0

Cycle time

<7s(Exclude printing and   cleaning)

Product changeover

<5mins

Equipment

 

Power requirements

AC220V±10%,50/60HZ,15A

Compressed air requirements

4~6Kg/cm2

Operating system

WIN7

External dimension

1152mm(L) x 1415mm(W) x 1540mm(H)(Without light,monitor and keyboard)

Machine weight

Around 1000Kg


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