Centrotherm c.VACUNITE 24.12.6 single plate vacuum soldering systems
Centrotherm c.VACUNITE 24.12.6
Single-Plate Vacuum Soldering System for Advanced Packaging and Power Semiconductors
The c.VACUNITE 24.12.6 is a high-performance single-plate vacuum soldering system designed for R&D and pilot-scale production. It delivers outstanding results in void-free soldering for power semiconductor and advanced packaging applications.
Key Features & Benefits
Excellent temperature uniformity of ±0.5%
Void-affected area can be reduced to less than 1%
Fast heat-up and cool-down rates for short cycle times
Maximum process temperature up to 450 °C
Processes under pure and oxygen-free atmospheres
Surface activation with 100% hydrogen (H₂), formic acid (HCOOH) or forming gas (N₂H₂)
Suitable for 100% paste and flux processes
Modular and scalable design
User-friendly touchscreen interface with recipe management
