3D Solder Paste
Inspection System
In comparison to other solder paste inspection systems, the SPI-Line 3D provides a true accurate measurement of applied solder paste. The solder paste printing is inspected for form, height, surface area, bridges, volume, x/y offset and coplanarity.
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1. Software interface SPI-Pilot: 3D display 2. Software interface SPI-Pilot: initial screen 3. PCB with solder paste |
PRECISE THREE-DIMENSIONAL SOLDER PASTE PRINTING MEASUREMENT
• Form • Bridges • X/Y offset • Surface area
• Height • Volume • Coplanarity
CAMERA HEAD OPTIMISED FOR SPEED
• 180 images per second at 4 megapixel resolution
• Highly precise 3D image capturing based on fringe projection technology
• Operating without moving parts
INTUITIVE SOFTWARE SPI-PILOT
• Touchscreen interface
• Program generation in less than 10 minutes
