VLO 180 / 300 vacuum soldering systems


The vacuum soldering systems VLO 180 and VLO 300 are ideal for high volume production facilities with various materials at up to 650 °C. They are equipped with integrated heating and cooling plates, which can be individually controlled. With the VLO 180 or VLO 300, the soldered area affected by voids can be reduced to less than 2 %, typical reflow soldering systems range at 20 %.


This system is ideal for production facilities which run flux less and void less soldering processes with various gas atmospheres N2, H2up to 100 %, N2/H2 95/5 %). It can also provide wet chemical activation with HCOOH and dry chemical activation with MW plasma for ultra clean soldering joints.

Even lead free paste or pre-forms can be used without additional flux.

The process control computer comes with a user-friendly touch screen for operating, process profile editing and recipe storing. A serial interface lets you transfer data to PCs for offline programming and remote service monitoring.



  • Hermetic Package Sealing
  • Hybrid Microelectronics Assemblies
  • MEMS Package Sealing
  • Optoelectronic Packaging
  • Power Semiconductors
  • UHB LED Packaging
  • Wafer Level Packaging


Features and Benefits

  • process temperature up to 650°C
  • excellent temperature uniformity
  • heating ramp up to 25 K/min
  • cooling ramp up to 180 K/min
  • vacuum level up to 10-2 mbar
  • very high throughput



  • 100 % H2 gas line with safeguards
  • HCOOH bubbler with safeguards
  • automatic door for robot handling systems
  • up to 6 thermocouples for surface temperature recording per plate


Centrotherm VLO 180/300 Flyer