Multi Line demonstrates full flexibility when inspecting THT assemblies. Various camera modules can be used for 3D measurements or for inspecting very tall components. The system allows transport with or without carriers and also enables return transport of assemblies in the lower part.
Multi Line enables 3D solder joint inspection of THT assemblies during return transport. A wide range of configuration and integration options are available, allowing Multi Line to be customized for the specific process and production line layout.
THT component inspection
| Measurement | z-Resolution | Measurement height | Clearance | |
|---|---|---|---|---|
| Component inspection | 3D | 1 µm | 35 mm | 110 mm |
| Solder joint inspection | 3D | 1 µm | 35 mm | 40 mm |
The Multi Line AOI system is available with PILOT AOI Version 7 software, which includes fully automated test program creation with the award-winning MagicClick, as well as many other innovative and user-friendly features.