Novastar's advances in the reflow process include an efficient low cost patented HORIZONTAL CONVECTION™ heating technology, a feature not available with other ovens. These advances enable our machines to have extremely accurate profiling capabilities whether for standard or lead-free solder paste. Novastar offers a wide range of reflow ovens to meet all of your reflow requirements. Models range from 12" benchtop to 20" floorstanding, high production units. All HT models have the new LEAD FREE soldering technology.
Novastar's patented Horizontal Convection™* design propels heated air currents within each isolated chamber thereby insuring precise control of profile parameters in each zone, and throughout the entire profile curve. The air is circulated toward one side of the oven above the PCB and toward the opposite side of the oven below the PCB, forming a circular air current or "cyclone" around the board. With the nitrogen inerting option, the isolated chamber design maintains low oxygen levels while conserving nitrogen consumption. The forced air circulation results in a uniform temperature profile along the entire circuit board assembly. This Horizontal Convection™ Technology works well with both standard and lead-free solders.
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