HIT Gun - Solder Pump Head
New developed solder pump head, with the advantage of supply solder paste automatically and saving cost to largest extent, is available and good for 0201 chip.
Auto. solder paste supply
Auto. pressure control
Perfect printing effect
No wasting of solder paste
X-axis printing head
Each axis movement of squeegee head is controlled by precise servo press independently to improve printing quality.
Customer can free exchange HIT GUN or conventional squeegee head according to actual requirement of production.
X-axis printing head
Adjusting squeegee head for mask wide range opening can have a better printing quality.
SPECIAL AND EXCELLENT
Description of the Stage
After printing the solder perfectly separated from the mask, so that to realize high quality printing.
Clamping system special for bend or deistorted PCB
Two way stage moves up and down for high quality printing
Silicona mate inlaided in cleaning head
It can fit the mask more closely and make cleaning effect perfect.
Four Fiducial Mask Teaching System
As for the PCB that deformed or with high tolerance, four fiducial marks can ensure more accurate when printing, while only two fiducial marks would lead more deviation.
Automatic Mask Moving Device
The new stencil moves to the printing position automatically.
SPI Printing Feedback System
After received the feedback information of bad printing from SPI, the printer can inspect and clean the mask holes automatically, thus improve printing quality and production rate.
Precision Camera Scanning
The segment Conveyors
Adopt Korea imported conveyor belt in the three segment conveyors
|Mask||Min. size||650x550 mm|
|Max. size||650x650 mm|
|Thickness/Weight||0.4 mm~6 mm / 4kg|
|Under clearance||17 mm|
|Transport direction||left->right/ right->left (Option)|
|Squeegee||Squeegee type||Metal squeegee/HIT GUN (soplder pump head)|
|Length||250 mm, 350 mm, 420 mm, 460 mm, 600 mm|
|Moving direction||X axis moving|
|Printing||Accuracy/Speed||±12.5 μm @ 6 sigma/ 1~300mm/s|
|8s (Excluding printing time)|
|Fiducial Mark||Type||User defined|
|Size||0.5 mm~3 mm|
|Mark number||Two, Three, Four|
|Speed/Distance||0.5 mm/s~ 30 mm/s / 0~5 mm|
|Cleaning head||Silicone pad|
|2D Inspection||Fov Camera||8.5 mm x 8 mm, CIS 640 x 480 Japan|
|Inspection||solder small or miss|
|Inspection Size||0.3 mm, over 0.3 mm|
|Max Teaching Window||500 window available|
|SPI Communication||Type||printing offset and cleaning|
|Air Condition System||PC Control system (option)|
|Other||Size/Weight||1330 x 1375 x 1490 mm/ 800 kg|
|Power supply/Air supply||220 V± 20V, 2KW 50/60 Hz/ 4~6/cm2|
|Operation system||Windows XP, Flash Memory Type HDD|