SPI-Line 3D automated paste inspection

3D Solder Paste
Inspection System

 

In comparison to other solder paste inspection systems, the SPI-Line 3D provides a true accurate measurement of applied solder paste. The solder paste printing is inspected for form, height, surface area, bridges, volume, x/y offset and coplanarity.

 

 

 

 

 

 

 

1. Software interface SPI-Pilot: 3D display

2. Software interface SPI-Pilot: initial screen

3. PCB with solder paste

 

PRECISE THREE-DIMENSIONAL SOLDER PASTE PRINTING MEASUREMENT


• Form • Bridges • X/Y offset • Surface area
• Height • Volume • Coplanarity

 

CAMERA HEAD OPTIMISED FOR SPEED


• 180 images per second at 4 megapixel resolution
• Highly precise 3D image capturing based on fringe projection technology
• Operating without moving parts

 

INTUITIVE SOFTWARE SPI-PILOT

• Touchscreen interface
• Program generation in less than 10 minutes

 

 

Goepel catalog


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