VLO 6 vacuum soldering system


The VLO 6 vacuum soldering system has been designed for Advanced Packaging and Power Semiconductor applications and achieves very high heating and cooling rates. The system meets the highest demands of Start-ups and R & D departments which use vacuum to achieve void less soldering joints. VLO 6 is the small-size entry level system of centrotherm's VLO-family with a 6 liter chamber volume, yet offering the full functionality like the other VLOs. With the VLO 6, the soldered area affected by voids can be reduced to less than 2 %, typical reflow soldering systems range at 20 %.




  • Advanced Packaging
  • Hermetic Package Sealing
  • Hybrid Microelectronics Assemblies
  • MEMS Package Sealing
  • Optoelectronic Packaging
  • Power Semiconductors
  • UHB LED Packaging
  • Wafer Level Packaging


This system is ideal for production facilities and start-ups which run flux less and void less soldering processes with various gas atmospheres (N2, H2 100, N2/H2 95/5). It can also provide wet chemical activation with HCOOH and dry chemical activation with MW plasma for ultra clean soldering joints.

Even lead free paste or pre-forms can be used without additional flux.

The process control computer comes with a user-friendly touch screen for operating, process profile editing and recipe storing. A serial interface lets you transfer data to PCs for offline programming and remote service monitoring.


Features and Benefits


  • process temperature up to 450 °C
  • excellent temperature uniformity
  • heating ramp up to 180 K/min
  • cooling rate up to 180 K/min
  • vacuum level up to 10-5 mbar
  • very short cycle time




  • 100 % H2 gas line with safeguards
  • HCOOH bubbler with safeguards
  • up to 4 thermocouples for surface temperature recording per plate


Centrotherm VLO 6 Flyer